Jetson-based hyperspectral and remote sensing data acquisition system

Client project: project fee $100,000. For a university agricultural remote sensing program: a rugged field terminal built around NVIDIA Jetson, with our own carrier board, system baseboard and power and interface boards, that brings a hyperspectral camera and other sensors into one acquisition system for crop observation, vegetation analysis and research datasets. After the engineering prototype, the same build went into an 80-unit follow-on run.

  • Client type: University agricultural research team (not named)
  • Units: Engineering prototype, then 80 units of follow-on production
  • Project fee: $100,000
  • Stage: Client project; production priced separately
Original case sheet: Jetson-based hyperspectral and remote sensing data acquisition system
Original case sheet

Overview and tech stack

Project type
Large robots and complex electromechanical systems
Computing
NVIDIA Jetson on a custom carrier board, Jetson/Linux environment
Electronics
Custom system baseboard, power-management board and peripheral interface boards
Sensors
Hyperspectral camera plus other field sensors, high-speed data connections
Power
System power architecture, module supplies, protection and internal distribution
Mechanical
Rugged enclosure, internal retention, cooling structure and service access

Main challenges

  • Several sensors share signal and power distribution inside a tight enclosure
  • High-speed connections, heat and field reliability decided where every interface sits
  • Internal mounting and wiring had to stay serviceable and repeatable for batch assembly

What we built

  • Requirements and hardware architecture for sensing, computing and field use
  • Jetson carrier board, system baseboard, interface boards and power circuits
  • Hyperspectral camera and sensor integration: electrical, data and mounting
  • Enclosure, internal mounting and cooling
  • Jetson/Linux bring-up and the acquisition workflow
  • Prototype build: PCBs, machined parts, debugging and interface tests
  • BOM and assembly documents for the 80-unit follow-on run

Project figures

Project fee
USD 100,000 (one-time system engineering)
Follow-on production
80 units, priced separately
Included
electronics and PCBs; mechanical design; software and firmware integration; engineering prototypes and testing

Figures from the client project itself; the client is not named. A quote for your build follows a review of your files.

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